PART |
Description |
Maker |
SSM6E03TU |
Multi-chip discrete device (P-ch N-ch)
|
TOSHIBA
|
HN2E05J |
MULTI CHIP DISCRETE DEVICE Super High Speed Switching Application
|
Toshiba Corporation Toshiba Semiconductor
|
MP2B5038 MP2B5085 MP2B5052 MP2B5150 |
A multi chip power device for a Multi-Oscillated Current Resonant type Converter
|
Fuji Electric
|
TPCP8J01 |
TOSHIBA Multi-chip Device Silicon P Channel MOS Type (U-MOSIV) Silicon NPN Epitaxial Type TOSHIBA Multi-chip Device Silicon P Channel MOS Type (U-MOSIV) /Silicon NPN Epitaxial Type MOSFET TPC Series
|
Toshiba Corporation TOSHIBA[Toshiba Semiconductor]
|
TH50VSF4682AASB TH50VSF4683AASB |
MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
CYM1841APR-20C CYM1841BPZ-25C CYM1841APY-20C CYM18 |
x32 SRAM Module X32号的SRAM模块 256K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PSMA72 PLASTIC, SIMM-72 256K X 32 MULTI DEVICE SRAM MODULE, 35 ns, PSMA72 PLASTIC, SIMM-72 256K X 32 MULTI DEVICE SRAM MODULE, 20 ns, PSMA72 PLASTIC, SIMM-72 256K X 32 MULTI DEVICE SRAM MODULE, 45 ns, PSMA72 PLASTIC, SIMM-72 256K X 32 MULTI DEVICE SRAM MODULE, 45 ns, PSMA64 PLASTIC, SIMM-64 256K X 32 MULTI DEVICE SRAM MODULE, 25 ns, PSMA64 PLASTIC, SIMM-64 256K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PZMA64 PLASTIC, ZIP-64
|
Cypress Semiconductor, Corp. Everlight Electronics Co., Ltd. Pyramid Semiconductor, Corp. YEONHO Electronics Co., Ltd.
|
585-3211 585-3213 585-3215 585-3221 585-3225 585-3 |
Multi-Chip BASED LED T1 3/4 Bi-Pin 585 SERIES BASED LEDs-MULTI-CHIP SINGLE COLOR DISPLAY CLUSTER, RED, 5.9 mm
|
Dialight Corporation Dialight PLC
|
SYS321000LK-012 SYS321000LK-015 SYS321000ZK-015 SY |
1M X 32 MULTI DEVICE SRAM MODULE, 15 ns, PSMA72 PLASTIC, SIMM-72 1M X 32 MULTI DEVICE SRAM MODULE, 15 ns, PZIP72 PLASTIC, ZIP-72 1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, PSMA72 PLASTIC, SIMM-72 1M X 32 MULTI DEVICE SRAM MODULE, 12 ns, PZIP72 PLASTIC, ZIP-72 x32 SRAM Module X32号的SRAM模块 1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, PZIP72 PLASTIC, ZIP-72
|
Sumida, Corp. TE Connectivity, Ltd.
|
ISD1100P ISD1100X ISD1112 ISD1110 ISD1120 ISD1110P |
Single-Chip Voice Record/Playback Device(Single-chip Durations of 12 seconds)(单片的录录音重放一片信息存储持续时12秒)) 单芯片语音记播放设备(单芯片的持续时12秒)(单片的录音/录音重放器(一片信息存储持续时12秒) Single-Chip Voice Record/Playback Devices 10- and 12-Second Durations(单片声音录音/回放芯片(单片信息存储持续时间12秒钟)) Single-Chip Voice Record/Playback Device(Single-chip Durations of 10 seconds)(单片的录录音重放一片信息存储持续时0秒)) Single-Chip Voice Record/Playback Device(Single-chip Durations of 12 seconds)(单片的录录音重放一片信息存储持续时2秒)) SINGLE CHIP VOICE RECORD / PLAYBACK DEVICES RES POWER .360 OHM 1W 5% SMT
|
List of Unclassifed Manufacturers Winbond Electronics, Corp. Winbond Electronics Corp ETC Electronic Theatre Controls, Inc.
|
AS8SLC128K32Q-55L_883C AS8SLC128K32Q-55L_IT AS8SLC |
128K x 32 SRAM SRAM MEMORY ARRAY 128K X 32 MULTI DEVICE SRAM MODULE, 12 ns, CPGA66 PGA-66 128K X 32 MULTI DEVICE SRAM MODULE, 12 ns, CQFP68 CERAMIC, QFP-68
|
Austin Semiconductor, Inc Micross Components
|
MT2LSYT3272B2G-12L MT4LSYT6472B2G-12L |
32K X 72 MULTI DEVICE SRAM MODULE, 12 ns, DMA160 64K X 72 MULTI DEVICE SRAM MODULE, 12 ns, DMA160
|
RECOM Electronic GmbH
|
MSM8256V-55/X0252 MSM8256V-025/X0252 MSM8256VM-025 |
256K X 8 MULTI DEVICE SRAM MODULE, 55 ns, CDIP32 256K X 8 MULTI DEVICE SRAM MODULE, 25 ns, CDIP32 256K X 8 MULTI DEVICE SRAM MODULE, 35 ns, CDXA32
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